Starting from 01.09.2019 an exciting student position in the field of lithographic nanostructuring is available. Micro- and Nanostructuring plays an essential role in the semiconductor manufacturing process. It implies both lithography and etch processes which are interdependent and should be precisely optimised for each specific application.
The focus of a current project will be nanostructuring for interconnects in the 22 FDX technology. The smallest distance required by this application is around 40 nm. This dimension is not directly reachable by the 193 nm immersion lithography used in the semiconductor foundries. Hence alternative approaches should be applied, as well as lithography and etch processes should be developed and optimised. At Fraunhofer IPMS e-beam lithography is used for investigation purposes due to its flexibility.
The tasks of the current thesis are:
- Development and adjustment of e-beam lithography processes for different stacks, which are relevant for 22 FDX technology
- Layout data preparation for e-beam exposure
- Investigation of the process window (variation of the process parameters, such as resist thickness and resist bake temperature)
- Characterisation of the resulting nanostructures using mainly CD-SEM (alternatively cross section SEM, AFM) and evaluation of the measurement results
Was Sie mitbringen
Was Sie erwarten können
We offer an exciting, up-to-date graduate position in which you can benefit from our experienced team. Our excellent industry-related research and development infrastructure provides you access to a large network of experts. You will become part of an inspirational international work environment based on trust, creativity and team spirit. Further, we offer opportunities for your further professional career.
In case of identical qualifications preference will be given to severely disabled candidates. We would like to point out that the chosen job title also includes the third gender. The Fraunhofer-Gesellschaft emphasises gender-independent professional equality.
We at the Fraunhofer IPMS develop electronic, mechanical and optical components and work on their integration into miniaturized modules and systems. We aim for customers who want to increase the functionality of their products by use of microsystems (MEMS, MOEMS, CMOS) with innovative features and smaller dimensions.
If you have any questions regarding this position, please do not hesitate to contact:
Ms. Dr. Varvara Brackmann
Tel.: +49 (0)351 2607 3015